Study on Enhancing Adhesion and Reliability in Wafer-Level Fan-Out Packaging
DOI: 10.23977/jeeem.2024.070112 | Downloads: 1 | Views: 86
Author(s)
Wenjing Cui 1, Ziyu Liu 2, Jieyu Zhou 3, Hongye Liu 1, Yabin Sun 3, Lin Chen 2,4, Qingqing Sun 2
Affiliation(s)
1 School of Optical-Electrical and Computer Engineering, University of Shanghai for Science and Technology, Shanghai, 200093, China
2 School of Microelectronics, Fudan University, Shanghai, 200433, China
3 Department of Electrical Engineering, East China Normal University, Shanghai, China
4 State Key Laboratory of Integrated Chips and Systems, Fudan University, Shanghai, China
Corresponding Author
Ziyu LiuABSTRACT
Wafer-level Fan-out packaging (FOWLP) with multi-layer redistribution layers (RDL) emerges as a pivotal technology in 3D integration. Polyimide (PI) as an insulation layer in the construction of RDL is essential for FOWLP. The adhesion of PI has become a focal point of multi-layer RDL. This study focuses on solving the adhesion technologies for PI photoresist lithography to achieve four layer RDL. The adhesion of PI to both the complex substrate and varying RDL layouts is investigated as a significant determinant of package reliability, characterized predominantly by surface free energy (SFE). It reveals that improving the substrate morphology by flattening can significantly enhance the PI adhesion, thereby addressing fluctuations caused by temporary bonding defects. Techniques such as CF4 dry etching and optimization of the temporary bonding process were found effective in mitigating substrate imperfections. Furthermore, various surface treatments applied to the RDL layers were investigated to boost the interface adhesion between the RDL and PI. Notably, after subjecting the plated copper to a 180W, 3-minute Argon plasma atmosphere, we observed an increase in roughness to 12 nm and an elevation in SFE to 80.82 mN/m, markedly improving copper surface adhesion. Additionally, employing Plasma-Enhanced Chemical Vapor Deposition (PECVD) to deposit SiO2 on the surface of the RDL layer substantially increased the SFE to 83.1±0.7 mN/m, demonstrating the most significant enhancement in PI adhesion. These advancements propose promising pathways to improve the structural integrity and reliability of FOWLP.
KEYWORDS
Wafer Level Packaging, Plasma, Descum, Adhesion, Surface roughness, PolyimideCITE THIS PAPER
Wenjing Cui, Ziyu Liu, Jieyu Zhou, Hongye Liu, Yabin Sun, Lin Chen, Qingqing Sun, Study on Enhancing Adhesion and Reliability in Wafer-Level Fan-Out Packaging. Journal of Electrotechnology, Electrical Engineering and Management (2024) Vol. 7: 92-99. DOI: http://dx.doi.org/10.23977/jeeem.2024.070112.
REFERENCES
[1] Son K, Kim G, Park Y B, et al. Effect of Dielectric Process on the Interfacial Adhesion of RDL for FOWLP[C]//2020 IEEE 70th Electronic Components and Technology Conference (ECTC). IEEE, 2020: 348-353.
[2] Zhang H, Liu X, Rickard S, et al. Novel Temporary Adhesive Materials for RDL-First Fan-Out Wafer-Level Packaging[C]//2018 IEEE 68th Electronic Components and Technology Conference (ECTC). IEEE, 2018: 1931-1936.
[3] Lu H, Takagi Y, Suzuki Y, et al. Demonstration of 3–5 μm RDL line lithography on panel-based glass interposers[C]//2014 IEEE 64th Electronic Components and Technology Conference (ECTC). IEEE, 2014: 1416-1420.
[4] Lau J H, Li M, Qingqian M L, et al. Fan-out wafer-level packaging for heterogeneous integration [J]. IEEE Transactions on Components, Packaging and Manufacturing Technology, 2018, 8(9): 1544-1560.
[5] Kim G, Son K, Kim D, et al. Effects of Dielectric Curing Conditions on the Interfacial Adhesion of Cu RDL for Fan-Out Wafer Level Packaging[C]//2019 IEEE 69th Electronic Components and Technology Conference (ECTC). IEEE, 2019: 937-941
[6] Yamanaka K, Yugawa H, Harazono M, et al. Interface Formation Between Metal and Polyimide in High Wiring Density Build-up Substrate[J]. IEEE Transactions on Components, Packaging and Manufacturing Technology, 2011, 1(5): 647-652.
[7] Liu W W, Wu L H, Weng B, et al. Plasma Treatment for Robust Interface Adhesion of Wafer Level Packaging[C]//2021 16th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT). IEEE, 2021: 64-67
[8] Atkins, Peter, and Julio De Paula. Physical chemistry. Vol. 1. Macmillan, 2006.
Downloads: | 2264 |
---|---|
Visits: | 101913 |
Sponsors, Associates, and Links
-
Power Systems Computation
-
Internet of Things (IoT) and Engineering Applications
-
Computing, Performance and Communication Systems
-
Journal of Artificial Intelligence Practice
-
Advances in Computer, Signals and Systems
-
Journal of Network Computing and Applications
-
Journal of Web Systems and Applications
-
Journal of Wireless Sensors and Sensor Networks
-
Journal of Image Processing Theory and Applications
-
Mobile Computing and Networking
-
Vehicle Power and Propulsion
-
Frontiers in Computer Vision and Pattern Recognition
-
Knowledge Discovery and Data Mining Letters
-
Big Data Analysis and Cloud Computing
-
Electrical Insulation and Dielectrics
-
Crypto and Information Security
-
Journal of Neural Information Processing
-
Collaborative and Social Computing
-
International Journal of Network and Communication Technology
-
File and Storage Technologies
-
Frontiers in Genetic and Evolutionary Computation
-
Optical Network Design and Modeling
-
Journal of Virtual Reality and Artificial Intelligence
-
Natural Language Processing and Speech Recognition
-
Journal of High-Voltage
-
Programming Languages and Operating Systems
-
Visual Communications and Image Processing
-
Journal of Systems Analysis and Integration
-
Knowledge Representation and Automated Reasoning
-
Review of Information Display Techniques
-
Data and Knowledge Engineering
-
Journal of Database Systems
-
Journal of Cluster and Grid Computing
-
Cloud and Service-Oriented Computing
-
Journal of Networking, Architecture and Storage
-
Journal of Software Engineering and Metrics
-
Visualization Techniques
-
Journal of Parallel and Distributed Processing
-
Journal of Modeling, Analysis and Simulation
-
Journal of Privacy, Trust and Security
-
Journal of Cognitive Informatics and Cognitive Computing
-
Lecture Notes on Wireless Networks and Communications
-
International Journal of Computer and Communications Security
-
Journal of Multimedia Techniques
-
Automation and Machine Learning
-
Computational Linguistics Letters
-
Journal of Computer Architecture and Design
-
Journal of Ubiquitous and Future Networks